2JK has Direct Sourcing Capabilities to Original Sources and Manufacturers of Downgraded Memory Products
2JK has World’s Most Competitive Technical Enabling and Software Capabilities
Codes for Speedy Sorting Process
High Speed Chip Sorting Program for DDR2 and DDR3
DIMM Test Program for High Speed DIMMs eliminating the use of RST Cards
Teradyne and Advantest Codes for Testing Chips and DIMM for SDR, DDR1,
DDR2, and DDR3
Complete Test Programs for Chip and DIMM Test development In-House for
Partial Memory Business
MP TOOL Interface for Testing USB Flash
Page Mode Testing for USB Drives
DG Flash Software to Sort ½ and ¼ Good Chips with Capabilities to Sort Other
Capacities.
2JK’s Focus is to “Go and Create New Markets”
Products Sourced with Technically Enabled are to be Sold to New Immerging and Growing Market like Southeast Asia (Indonesia), India, and Middle East through Strong Networks in Regional Contract Manufacturers, Government Infrastructure Development Agencies and Agents; and secondary IT, Consumer Electronics, Gaming, and other markets who they need Downgraded Memory Solutions.
Micro SD Cards
USB/UFD Manufacturing
DRAM Memory Module
MCP / e-MMC for MID/Mobile Phone Manufacturer
DRAM and Flash Components for 2nd Low-End Market IoT Devices
DRAM Components for Mid & Low-End Set-Top Box Manufacturing
Business Model & Process for OVERVIEW
Business of Interests
Wafer
DRAM
Wafer Level
Assembly PKG
Good Wafer
LPDDR
MCP (Add Flash + Controller)
Normal DDR
FBGA
Low yield Wafer
FBGA
Flash
Good Wafer
TSOP, Micro SD, USB Sip
BGA
eMMC (Add Controller)
MCP (Add Controller + LPDDR)
Partial Wafer
BGA
TSOP, Micro SD, USB Sip
Low yield Wafer
TSOP, USB Sip
Ink Wafer
TSOP
Component
DRAM
Component (Reclaim)
MCP, BGA – Sorting – Bin 1, Bin 2
Flash
TSOP, Micro SD, USB Sip
BGA
eMMC (Add Controller)
MCP (Add Controller + LPDDR)
LGA**
Sorting:
Bin 1 (full), 2 (half), 3 (quarter), 4 (eighth)
Module,Card,SIP
SSD,Embedded
DRAM
Module (RMA)
Rework DDR Module – BGA (single IC)
And sell to market by IC
Flash
Pen-Drive
Rework – TSOP or BGA
And sell to market by
TSOP / BGA
SSD
Business Model for DRAM
Test-House Service for DRAM Component
AGENDA
CONTENTS
DRAM Components System Level Test for Module
DDR4 X4 for Server, High Speed (Over Clocking) for Gaming Module, Test for UTT & Reworked
RDIMM, UDIMM/SODIMM for PC & Workstation, Over-Clocking UDIMM/SODIMM for GamingPC
DRAM Module Refurbishment (Rework) BUSINESS
AGENDA
CONTENTS (1)
CONTENTS (2)
Failed DRAM Module RDIMM UDIMM SODIMM
Failed DRAM
DDR4 & DDR3
Scrapped DRAM
To Make 2Gb DRAM Based In-house Modules
2GB/4GB UDIMM / SoDIMM
Detaching, Cleaning, Reshaping for Ball without
Re-balling process
Sourcing DRAM Components & Module BUSINESS
AGENDA
CONTENTS
Failed DRAM
Module &
Scrapped
DRAM Package
(DDR4/DDR3)
Failed DRAM Module (DDR4 / DDR3)
DDR4
DDR3
Scrapped DRAM Package (DDR4 / DDR3)
Business Model for NAND FLASH
Test-House (Sorting) Service for NAND FLASH
AGENDA
CONTENTS
NAND FLASH, INK-DIE WAFERS and FAILED COMPONENTS & MODULES SYSTEM LEVEL TEST
16GB MLC Inked Die Test> 3 Steps Test – Binning : 16GB / 8GB / 4GB
8GB MLC Inked Die Test> 2 Steps Test – Binning : 8GB / 4GB
Component Test
Module Test
Sourcing Capabilities of NAND FLASH Ink-Die Wafers, Low Yield Wafers, Components & Module BUSINESS
